LaserVia Drilling Systems

LaserVia Drilling Systems are:

  • Clean

  • Fast (1000 vias per second)

  • Able to drill multiple layers on a single pass

  • Stable

  • Easy to use

  • Give highest yield.

The most costly and time-consuming process in the fabrication of today’s multi layer circuit board is that of making these z-axis interconnections or microvias. The decreasing size of the vias being demanded and the growing number of vias per panel drive fabrication costs. Current technology for producing microvias is slow and inadequate for producing the size, volume and complex patterns required by the highly competitive high-tech industry. The capital equipment needs for increased capacity are staggering because the machines currently in use are slow, requiring multiple phases and adjustments. In addition, personnel costs are high due to the operators requiring specialized training.

Component density and electronic functionality of today’s multilayer circuit boards can be improved with the introduction of cost-effective, variable depth laser drilled blind microvia interconnections. Laser technology is being quickly adopted into the circuit board industry but can be accelerated with the introduction of a true production laser drilling system like the LaserVia™ patented system.

 

The ‘Pathfinder 2000’

From the time printed circuit boards (PCBs) were first introduced, demand for increased function in smaller formats has driven the market. This has moved the market to multi-layer, high-density boards and from mechanical drilling to lasers. Laser technology has been around for nearly 30 years, but has just recently been accepted by the industry as a method for producing blind microvias. Mechanical drilling and even plasma etching are no longer in wide use for this purpose. Only photo-microvia formation holds a far distant second place to lasers for microvia drilling.

Microvias are small-diameter channels—usually less than 0.150 mm—drilled in printed circuit boards to enable high-density circuitry and are used anywhere that requires increased function in a smaller format. The advantage of LaserVia drilled blind microvias is in our unique ability to drill multi-depth blind microvia interconnections as part of the multilayer process without using build up technologies. These multi-depth blind vias are stacked rather than staggered as depicted in the illustration at left.

Three Level Laser Drilled Blind Vias

Circuit board component (integrated circuits and passive components) densities have reached a plateau and the only obvious solution is to find methods for incorporating more surface interconnections to these components with z-axis interconnections to the other layers of a multilayer circuit board.

LaserVia laser drilling systems have been built, tested and licensed (R&D) for use at Sandia Labs in New Mexico and was in use at the LaserVia Drilling Center in Oregon’ now closed.