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The Technology
Q. Can LaserVia™ Systems put blind vias in pads?
A. Sure, it’s one of the major advantages of LaserVia™ Systems technology. We can drill blind or buried via interconnections to multiple depths using only a single pulse.
Q. How does the LaserVia™ Drilling System work?
A. It uses a pre-etched conformal mask with all the windows needed to create the vias. It is not vector or point-to-point but a scanning or ‘drill on the fly’ technique.
Q. How can you drill ‘on the fly’?
A. We have a patented beam technology that allows very accurate energy delivery to every via with no need to stop as there is in point-to-point processing. Our laser beam is turned on as it just begins to pass over the etched window and travels on a split axis.
Q. What do you mean when you talk about LaserVia™ System’s ‘single pulse’ or ‘multiple approach’ method of laser drilling?
A. This patented method of laser drilling multiple vias of multiple diameters at multiple depths is the core of the LaserVia™ patented process. With a single pulse we can laser drill down two levels interconnecting circuit layers one to two to three; one to two; or two to three. In addition, when the pitch or density of the windows is in close proximity, we can laser drill multiple vias with a single pulse.
Q. What kind of laser do you use?
A. It’s a RF excited CO2 laser.
Q. Does it take an engineer to run LaserVia™ Systems machines?
A. No. Our LaserVia™ machines are pretty much ‘fool proof.’ We can train a technician to run one in a matter of hours.
Q. Just how fast is the LaserVia ™ Drilling System?
A. The LaserVia™ System can drill thousands of vias per second. We have laser drilled 64,440 points per minute on a grid interconnecting layers at levels one and two. Speeds on other circuits depend on the density of the design.
Q. Can you drill all materials that fast?
A. No, this innovative technology is created for laser friendly, fast growing materials like Aramid reinforced, resin coated copper, PTFE or polyimide—all without glass reinforcement. We work with the physical properties of the materials and do not try to defy physics.
Q. Are there energy savings associated with using LaserVia™ System?
A. It stands to reason that there are, but it is not something we have measured yet.
- LaserVia™ Systems drill multiple vias with a single pulse, while other systems take multiple pulses to drill a single via;
- we use fewer machines, and
- we produce vias 40X faster than other systems
Less energy is likely to be used with LaserVia™ Systems.
Q. All other aspects of circuit board manufacture are conveyorized. Can your laser drilling process work this way?
A. We have a patent pending for a conveyorized laser drilling process that will soon be demonstrated in our LaserVia™ Drilling Center.
Q. How does this system fit with mechanical drilling?
A. Right now it is a complementary technology. However, laser drilling may eventually replace much of the mechanical drilling.
Q. We know our UV laser drilling technology is too slow, but we think CO2 laser technology loses money because of the materials required.
A. While UV lasers can remove copper, it is not a cost-effective process. Time really is money, and the costly bottleneck in the fabrication process created by drilling is virtually eliminated by our patented process. The LaserVia™ System uses CO2 and conformal masking etched windows and is nearly 40X faster than conventional laser drilling methods such as UV with interconnects down to level three. This makes material costs significantly less important.
Q. How can you outperform competitors as you claim?
A. It’s a totally different approach: we designed the system for large volume production and focused only on laser drilling materials that will allow the system to reach it's near maximum speed. We are less flexible than competitors but far more productive.
Q. Where can I get more information about this process?
A. Go to the LaserVia Library for a variety of technical papers, or contact us at Tel: 503-570-2666, Fax: 503-570-4239, e-mail: information@laservia.com.
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The Materials
Q. No FR4?
A. No, it’s a matter of energy: to break chemical bounds on glass fibers you need multiple laser hits. This means the beam must be pulsed at high enough energy to vaporize the glass fibers of the FR4, but low enough not to damage the copper on each via. Extensive pulsing dramatically effects productivity and energy consumption.
Q. Are non-glass-reinforced materials as reliable as FR4?
A. New generation materials like DuPont's Thermount® and Thermount® RT™ comply to MIL standards and are UL approved. Click here for more information on Thermount® and an Aramid Evaluation Chart.
Q. Why is material dimensional stability so important?
A. To increase interconnection density, microvias need to be associated with small pads. This requires a highest level of dimensional consistency and predictability, which is enhanced by non-glass-reinforced materials.
Q. How do you prevent burning of the dielectric?
A. We have a unique beam delivery system that ensures debris removal and prevents charring.
Q. Is there any risk of damaging the copper?
A. CO2 laser is reflected by copper, no damage is possible when the beam energy is set within it's broad operating range.
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The LaserVia™ System
Q. What do I need to introduce LaserVia™ into my production process?
A. One or more LaserVia™ Drilling Systems will effectively drill production volumes of properly designed single and multi-depth blind via circuit boards.
Q. Will I have to buy any additional equipment?
A. No. LaserVia™ Systems technology is perfectly compatible with your existing equipment.
Q. How do I create LaserVia™ files?
A. A complete CAM is included, providing the optimizing program to convert Gerber files into LaserVia™ format.
Q. How do you align the panels with the automatic loading/unloading system?
A. The LaserVia™ Systems come equipped with a CCD Camera system that locates fiducial windows to automatically align the panel.
Q. How small can you laser drill?
A. Basically, as small as a fabricator can etch, within reason—usually down to say 3-4 mils (0.07 mm - 0.1 mm). Most of the typical problems we encounter are related to the fabricator’s ability to electroplate small laser drilled blind vias.
Q. Do you have a maximum size for vias you produce?
A. We can drill up to 30 mils (0.762 mm), but we recommend not exceeding 10 mils (0.254 mm) to fully exploit microvia interconnection potential.
Q. What is your accuracy?
A. That depends on the accuracy of the fabricator’s ability to align etched windows.
Q. Your Web site says that you are not yet mass-producing the LaserVia™ System. How long would it take to get one if I ordered one?
A. We expect to be in limited production by third quarter 2001. However, we could have a machine built—without the latest beam delivery invention— and on its way to you in approximately four months from the time an order is placed.
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LaserVia Drilling Services
Q. I need really quick turn-around on my project. How fast are you really?
A. You’d be surprised at how fast we are. We can get prototypes out within 24 hours, and most of our jobs are done in less than 72 hours—shipping time excluded.
Q. My company needs total fabrication. Does LaserVia™ Drilling Center just drill the boards or are you also a circuit board fabricator?
A. Our primary focus is in laser drilling using our unique patented process. Our drilling centers provide a contract laser drilling service to the circuit board fabrication industry in North America. However, we enjoy relationships with prototype shops and fabricators that allow us to quote a complete microvia fabrication job when necessary.
Q. I’m interested in using your technology, but I’m not sure my plans are the most effective for your system. Can you help me?
A. We have consultants who can advise you the best way to take advantage of LaserVia™ Systems unique characteristics.
Q. How much do you charge for your services?
A. Contact us with your job particulars at RFQ@laservia.com or at Tel: 503-570-2666, Fax: 503-570-4239. You will find our prices to be competitive.
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