LaserVia Drilling Centers

Fast turnaround for prototyping (24 hours)

Production drilling for high volume microvia laser drilling

Over 14 years laser drilling experience ~ the most experienced laser via drilling service in the US.

Microvia consulting

LaserVia Drilling Centers can take care of business for you. We are able to do high volumes of complex blind microvias with our patented laser drilling systems. Although our focus is in laser drilling multi-level microvias, we enjoy relationships with prototype shops that allow us to quote a complete microvia fabrication job. Our consultants can help you plan the best way to get your job done, and our technicians can get it done for you. For further information or to request a quote, please contact us at requestforquote@laservia.com.

Be sure to include your specifications in your RFQ:

  • Vias per each side of panel to level 1 (layer 2)
  • Vias per each side of panel to level 2 (layer 3)
  • Number of panels
  • Dielectric material
  • Thickness of dielectric material

Also include your time requirements. We can complete your job in 72, 48 or even 24 hours (plus ship time).

Cross-sectional photomicrographic progression of laser drilled blind microvias . . . .

2000: LaserVia drilled multi-depth blind via interconnection using epoxy Thermount ®.
1984: Blind via interconnection with predecessor to RCC/RCF.
1998: Polyimide Thermount®, courtesy of Electro Plate Circuitry, Carrolton, Texas.
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