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At the heart of LaserVia™ is a series of patented and proven solutions to the problems presented by the demand for increasing numbers of smaller microvias in complex, high density printed circuit boards (PCBs).
To reach the next level for improving the component density and electronic functionality of today's multilayer circuit boards LaserVia™ uses a cost-effective, variable depth laser technology to accurately drill blind microvia interconnections at unparalleled speed, complexity and cost savings.
LaserVia™ drilling systems are inexpensive to run and easy to control, and can drill both large and small panel areas.
LaserVia Drilling Systems can equip your operation with any number of laser drilling stations built to your needs for a fraction the cost of other drilling systems.
LaserVia Drilling Centers can handle your PCB drilling orders, including your most complex multilayer requirements, and save you time and money.
Contact us today…
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