At the heart of LaserVia® is a patented and proven solution to the costly issues presented by the demand for the increasing numbers of smaller microvias in complex, high density printed circuit boards (PCBs) and photovoltaic (PV) interconnections.
To reach the next level for improving the component density and electronic functionality of today's multilayer PCBs and PV interconnections, LaserVia® uses a cost-effective, variable depth laser technology to accurately drill blind microvia interconnections at unparalleled speed, complexity and cost savings.
LaserVia® Drilling Systems are inexpensive to run and easy to control, and can drill large panels, small panels and reel-to-reel.
LaserVia® Drilling Systems can equip an operation with any number of laser drilling stations for their needs at a reduction in the costs of other drilling systems.
LaserVia® Technology is for sale including a fully functional large panel laser system (Pathfinder 2000) plus a designed and patented new laser system set to be fully automated with extremely high drilling rates (vias per second). Five issued Patents, the registered Trademark LaserVia® and domain www.laservia.com are available along with the purchase of the stored Pathfinder 2000.